| 2020 國際半導體展_創新3D封裝製程技術整合研討會 |
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| 各場次及主題如下 |
1) Topic: Using PulseForge Tools to Solder Components onto Temperature Sensitive Substrates Using Standard SAC Solder Alloys. |
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2) Topic: Integrating Aerosol Jet Solutions into Your Printed Electronics R&D and Production. |
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3) Topic: Inkjet Printed Electronics - ElectroJet brand solutions. |
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4) Topic: Maskless µAM copper printing for below 5 µm structures - A new approach for SiP and Heterogeneous Integration. |
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5) Topic: Precision Microdisepensing of Adhesives, Conductives and Solder for Electronic Packaging Applications. |
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6) Topic: Next Generation Aerosol-Based Printing for Production-Level Printed Electronics. |
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7) Topic: A New micro plotter solution, Via filling and very fine features printing by sonoplot micro plotter. |
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 8) 公司名稱 |
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9) 參加人姓名 |
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10) 手機號碼 |
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